IRVINE, Calif.–Newport Corp. today announced it has received a U.S. patent for a robotic system design that grips 300-mm wafers by their edges and reduces the risk of damage while moving silicon ...

Newport Corp. today said it has been awarded a U.S. patent for a 300mm edge-grip robotic end effector apparatus that allows semiconductor manufacturers to handle 300mm wafers by only their edges ...

WESTWOOD, Mass.--(BUSINESS WIRE)--Oct. 26, 2005--ADE Corporation (Nasdaq: ADEX) today announced that the leading expert in wafer polishing, Peter Wolters AG, has purchased and installed a ...

(MENAFN- JCN NewsWire) Hitachi High-Tech Launches High-sensitivity and High-throughput Wafer Surface Inspection System LS9300AD for Wafer Manufacturers LA9300AD enables detection of shallow ...

Semiconductor Wafer Inspection Equipment Market Report 2024 · GlobeNewswire Inc. Dublin, Nov. 12, 2024 (GLOBE NEWSWIRE) -- The "Semiconductor Wafer Inspection Equipment Market Report 2024" report has ...

Reducing defects on the wafer edge, bevel, and backside is becoming essential as the complexity of developing leading-edge chips continue to increase, and where a single flaw can have costly ...

As device sizes continue to increase on devices at 2x nm design rule and beyond and high wafer stress is worsening due to multi-film stacking in the vertical memory process, we observe an increasing ...

LA9300AD enables detection of shallow microscopic defects, contributing to reduced manufacturing costs and improved yield. TOKYO, Mar 15, 2024 - (JCN Newswire) - Hitachi High-Tech Corporation ...