The EoPlex xLC™ substrate is a sintered metal array of wire bond and die attach pads delivered on a temporary thin metal strip, referred to as a lead carrier. The product is designed to be a direct ...
VILLACH, Austria & SIEGEN, Germany--(BUSINESS WIRE)--The two specialists in thin wafer handling systems, mechatronic systemtechnik and ProTec Carrier Systems (PCS), are intensifying their ...
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