In recent years, the area array components like BGA, QFN, CSP, and flip chips, are aplicate wider and wider in the electronics manufacturing. Such as BGA, comparing with other components, it has ...
Agilent Technologies has introduced the Medalist SP50 Series 3 solder-paste inspection system for inspecting printed-circuit-board assemblies. Systems in the Medalist SP50 family offer interchangeable ...
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