The stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by 1-fold, SiC power modules allow for ...
A new technical paper titled “Liquid Metal Fluidic Connection and Floating Die Structure for Ultralow Thermomechanical Stress of SiC Power Electronics Packaging” was published by researchers at ...
It shows the response of the device to stimulus in mathematical manner with little or no consideration for the underlying device physics. Semi-physics model describes the semiconductor physics and it ...
What advantages do SiC power modules offer versus silicon IGBTs? A gate-driver family that helps make the switch to these SiC modules. The introduction of Microchip Technologies' 1,700-V ...
The power semiconductor market is poised for remarkable growth in the next several years, fueled by the adoption of electric vehicles and renewable energy, but it also driving big changes in the ...
EasyPack 1B and EasyPack 2B 1200 V power modules from Infineon Technologies integrate CoolSiC silicon carbide MOSFETs for energy-efficient electric vehicle (EV) charging stations and uninterruptible ...
The quest for ever-higher power densities has encouraged the rise of breathtaking levels of active/passive device integration and cool-running packaging technology. Advanced packaging technologies are ...
MUNICH--(BUSINESS WIRE)--Vincotech, a supplier of module-based solutions for power electronics is the go-to source for SiC-based power modules that boost efficiency and enable more compact designs. No ...
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