Today’s heterogeneously integrated semiconductor packages represent a breakthrough technology that enables dramatic increases in bandwidth and performance with reduced power and cost compared to what ...

Consumer electronics – tablets, smartphones and e-readers – is now leading the industry in growth. For system manufacturers and integrated circuit (IC) suppliers, the challenge involves keeping pace ...

The benefits of 3D IC architectures are well-documented – smaller footprints, lower power, and increased performance. However, the move to heterogeneous 3D designs also introduces a host of new ...

A semiconductor manufacturing company has little control over the system in which its parts are used. However, the system in which the IC is mounted is critical to overall device performance. For ...

Siemens Digital Industries Software is adopting a new approach for sharing accurate thermal models of IC packages to the electronics supply chain. The main advantages are protecting IP, enhancing ...

Packing more IC functionality into smaller form factors stacks the deck against IC makers and foreshadows difficult interconnect challenges. How much can one package take? As consumer electronics ...