A new technical paper titled “Liquid Metal Fluidic Connection and Floating Die Structure for Ultralow Thermomechanical Stress of SiC Power Electronics Packaging” was published by researchers at ...
Humidity resistance and reliability of different packaging structures is analyzed, including the high/low temperature and temperature cycle reliability and the thermal characteristics in different ...
Although cage-based porous materials, metal-organic polyhedra (MOPs), are attracting attention as an emerging functional platform for numerous applications, hardly predictable and seemingly ...
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