A new technical paper titled “Liquid Metal Fluidic Connection and Floating Die Structure for Ultralow Thermomechanical Stress of SiC Power Electronics Packaging” was published by researchers at ...

As semiconductor devices scale for AI computing, advanced packaging and high density interconnects, manufacturers face growing challenges in measuring ultra ...

Although cage-based porous materials, metal-organic polyhedra (MOPs), are attracting attention as an emerging functional platform for numerous applications, hardly predictable and seemingly ...

Humidity resistance and reliability of different packaging structures is analyzed, including the high/low temperature and temperature cycle reliability and the thermal characteristics in different ...