Semiconductor Engineering

Analysis Of Multi-Chiplet Package Designs And Requirements For Production Test Simplification

In recent years there has been a sharp rise of multi-die system designs. Numerous publications targeting a large variety of applications exist in the public domain. One presentation [2] on the IEEE’s ...
Semiconductor Engineering

Easing The Stress For Package-Level Burn-In

Considered something of a necessary evil, burn-in of IC packages during production does a great job of weeding out latent defects so they don’t turn into failures in the field. But as AI and ...
EDN

System-level test’s expanding role in producing complex chips

System-level test (SLT), once used largely as a stopgap measure to catch issues missed by automated test equipment (ATE), has evolved into a necessary test insertion for high-performance processors, ...
Morningstar

Aehr Seeing Momentum in Package-Level Burn-In Alongside Expanding Wafer-Level Burn-in Demand

FREMONT, CA / ACCESS Newswire / November 12, 2025 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in solutions, today announced the shipment of its Dual-Echo™ ...
Seeking Alpha

Major Hyperscaler Expands AI Processor Production Capacity with Additional Aehr Test Package-Level Test and Burn-in Systems

FREMONT, CA / ACCESS Newswire / August 25, 2025 / Aehr Test Systems (AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced it has received additional follow-on ...