Antenna performance isn't just about the antenna itself. The PCB beneath it is determining range, efficiency, & wireless ...

Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...

Abstract—The market for Semiconductor Intellectual Property is well served for standard process technologies but not all functions are offered in all processes. Mixing and matching high performance ...

Eventually, almost every EE must design a PCB, which isn’t something that’s taught in school. Yet engineers, technicians, and even novice PCB designers can create high-quality PCBs for any and every ...

This is the first of several articles in the PCB Design Best Practices series, which discusses the different steps of PCB development from the basics of creating a design schematic with specific ...

The entire semiconductor ecosystem is starting to tackle a long list of technology and business changes that will be needed to continue scaling beyond Moore’s Law, making heterogeneous combinations of ...

Surface-mount technology (SMT) is evolving far beyond its roots as a way of assembling packaged chips onto printed circuit boards without through-holes. It is now moving inside packages that will ...

Silicon interposer technology allows multiple die to be combined onto a single chip. This is different from stack or multi-die chips that use wires to connect to a substrate. Essentially, the ...