Along with emerging metaverse concepts, there is growing demand for equipment for package IC and HPC (high-performance computing) chips, as well as bonding mini/microLED chips, according to executive ...

As a result of the high demand for advanced packaging materials in 2024, IC packaging material distributors such as Chang Wah Technology (CWTC), Niching Industrial, Topco Scientific, and Wahlee ...

As highlighted by Towards Packaging research, the global packaging machinery market, valued at USD 53.26 billion in 2025, is ...

Ottawa, Nov. 26, 2025 (GLOBE NEWSWIRE) -- The global semiconductor and IC packaging materials market generated revenue of USD 48.48 billion in 2025, and this figure is projected to grow to USD 114.28 ...

IC packaging has come into its own, where once traditional packaging was a “necessary evil,” today’s packaging can add significant value. There is an increase in functional density and flexibility by ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

Manufacturing-aware system design treats dies, interposers, packages, and analysis as a single, coherent system.

Advanced packaging that’s no bigger than the die itself brings together high performance and high reliability with small size and low cost. Not so long ago, defense and aerospace applications were the ...

The PackML automation standard is used in the packaging machine industry to transfer and receive consistent data between machines on a packaging line. While it's well known to machine builders, it ...