Flash memory has made incredible capacity strides thanks to monolithic 3D processing enabled by the stacking of more than 200 layers, which is on its way to 1.000 layers in future generations.[1] But ...
SK Hynix has unveiled a long-term roadmap for next-generation DRAM technologies, laying out a vision that aims to drive sustainable innovation over the next 30 years as the global semiconductor ...
A new technical paper titled “Three-dimensional integrated metal-oxide transistors” was published by researchers at KAUST (King Abdullah University of Science and Technology). Find the technical paper ...
Developed core technology that will allow practical implementation of high-density, low-power 3D DRAM, presented at IEEE International Electron Devices Meeting (IEDM) ...
TL;DR: NVIDIA envisions the future of AI compute with innovations like silicon photonics interposers, 3D stacked DRAM, and GPU tiers. The approach includes module-level cooling, die-to-die electrical ...
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