The popularity of cloud computing and AI—driving massive data flows—pushes demand for ultra-high-speed, energy-efficient ...

3D integrated circuits promise smaller, faster devices with lower power consumption. Vertically stacked 3D integrated circuits also enable novel in-memory and in-sensor computing paradigms and ...

A technical paper titled “Flexible electronic-photonic 3D integration from ultrathin polymer chiplets” was published by researchers at Dartmouth College and Boston University. The paper states: “Here, ...

A new technical paper titled “Heterogeneously integrated lithium tantalate-on-silicon nitride modulators for high-speed communications” was published by researchers at EPFL, Chinese Academy of ...

Data center interconnect design and manufacturing startup OpenLight Photonics Inc. says it wants to accelerate the transition to silicon photonics after spinning out of its parent company Synopsys Inc ...

For decades, the semiconductor industry has relied on the relentless pursuit of Moore’s Law—the doubling of transistors on an IC every two years—to deliver ever-increasing performance and ...

Digital lithography technology (DLT) is promising chipmakers to combine chips with submicron wiring on glass and other large substrates. And this maskless technology is at the center of a strategic ...

Dr. Jawad Nasrullah is the CEO of Palo Alto Electron Inc., leading research and development in heterogeneous integrated circuits and 3D ICs for high-performance computing. He co-leads the Open Chiplet ...

Inertial sensors were equipped on the developed device, and the results measured by the sensors on the device can be transmitted even under 150% elongation. Stretchable, wearable devices that can ...