The European semiconductor ecosystem continues to evolve, driven by the ambitions outlined in the EU Chips Act. With goals to strengthen Europe’s technological leadership and double its semiconductor ...
In industry, we see more and more examples of systems being built through heterogeneous integration leveraging 2.5D or 3D connectivity. In this interview, Eric Beyne, Senior Fellow, VP R&D and Program ...
Are you feeling nostalgic for homogeneous integration of chips – one flat board where you can use your fingers to stuff in all the circuitry you need? Best to head to the Lego store or Russia. The ...
The terms “chiplet” and “heterogeneous integration” fill news pages, conference papers, and marketing presentations, and for the most part engineers understand what they’re reading. But speakers ...
Monolithic integration has been the dominant approach to chip design since the rise of VLSI-based ASICs decades ago. In a monolithic design, all of the building blocks of integrated circuits such as ...
The Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office (MTO) is requesting information to guide the establishment of a domestic research and development (R&D) center for ...
November 9, 2013. Imec announced that it has successfully demonstrated the first III-V compound semiconductor FinFET devices integrated epitaxially on 300-mm silicon wafers, through a unique silicon ...
US-based foundry SkyWater Technology has completed the first phase of its program to establish silicon interposer manufacturing, according to an announcement on November 3. The program, named ...
In industry, we see more and more examples of systems being built through heterogeneous integration leveraging 2.5D or 3D connectivity. In this interview, Eric Beyne, Senior Fellow, VP R&D and Program ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback