The discovery of the float glass process followed by curtain wall glazing systems resulted in the integration of huge areas of glass products in the design of several large buildings. However, the ...

The chip industry is conservative when it comes to adopting new metrology and inspection. Will it ultimately see NVD inspection as a wunderkind, or an also-ran? Remember when it first became obvious ...

Defect inspection scientists from Huazhong University of Science and Technology, Harbin Institute of Technology and The Chinese University of Hong Kong make a thorough review of new perspectives and ...

Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

MILPITAS, Calif., July 8, 2019 /PRNewswire/ -- Today KLA Corporation (NASDAQ: KLAC) announced the 392x and 295x optical defect inspection systems and the eDR7380™ e-beam defect review system. The new ...

Flip chip microelectronic packaging has emerged as a cornerstone technology in modern semiconductor assembly, wherein the die is mounted upside down to the substrate to facilitate direct ...

Packaging advances are driving innovation at KLA-Tencor, which in May announced two new systems that support advanced semiconductor packaging technologies: CIRCL-AP and ICOS T830. Designed for ...

Wafers produced for products as diverse as LEDs and MP3 players vary greatly in function, but they have one thing in common: They often undergo optical inspection after they pass an electrical test.

San Francisco, CA. KLA-Tencor today announced two new defect-inspection products, addressing key challenges in tool and process monitoring during silicon wafer and chip manufacturing at the ...

Onto has received multiple orders in support of high bandwidth memory (HBM), advanced logic and a variety of specialty segments WILMINGTON, Mass.--(BUSINESS WIRE)--Onto Innovation Inc. (NYSE: ONTO) ...