Thermal interface materials (TIMs) have been widely adopted for improved thermal dissipation in flip chip ball grid array (FCBGA), flip chip lidded ball grid array (FCLGA) and flip chip pin grid array ...
ESCONDIDO, Calif., March 29, 2021 (GLOBE NEWSWIRE) -- QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced expanded ...
Engineers use a redistribution layer (RDL) in flip-chip designs to redistribute I/O pads to bump pads without changing the I/O pad placement. However, traditional routing capacity may be insufficient ...
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