Hsinchu, Taiwan, Mar. 08, 2017 – H.P. Lin, Chairman of M31 Technology today announced that it deploys a full range of silicon IP in TSMC's 16nm FFC (FinFET Compact) process technology. With TSMC's ...
Hsinchu, Taiwan, Mar. 14, 2016 – eMemory announces today that its OTP technology NeoFuse has been verified in 16nm FinFET Compact process (16FFC), marking an important milestone as the world's first ...
Targeting applications that use flexible printed circuit (FPC) or flexible flat cable (FFC), Hirose Electric developed a halogen-free, 0.5-mm-pitch, zero-force-insertion (ZIF) connector. The FH52’s ...
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