A new technical paper titled “Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects” was published by researchers at Siemens EDA, D2S, and Univ.
What are S-parameters? The multiple types of S-parameters beyond the small-signal variety. Using S-parameters, we can represent even the most complex RF device as a simple N-port network. Figure 1 ...
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