To meet the growing need to test smaller components, Aries Electronics now offers its high-frequency center probe and CSP/MicroBGA test and burn-in sockets in sizes to accommodate devices up to 6.5 mm ...
Ironwood Electronics has released a new test socket for BGA devices; it features a clamshell lid design for ease of chip replacement in the production environment. Besides final production test, the ...
Accommodating any integrated device type measuring up to 27 mm, the Integra 27 test socket is molded from PPS plastic components designed to minimize space without compromising repeatability and ...
A new RF center-probe test socket accepts devices from 14 to 27 mm2. It's designed for pitches down to 0.5 mm and speeds from 1 to over 10 GHz in CSPs, MicroBGAs, MLFs, QFNs, and LGAs. A four-point ...
Advanced AI/CPU processors demand extreme high frequency and power performance from SLT and ATE test sockets. These sockets are in the critical path at the end of a very costly silicon fabrication and ...
The 0.8 mm pitch BGA socket adapter from Ironwood Electronics provides an interposer solution for prototyping, testing and ...
As semiconductor devices continue to advance, the demand for reliable, high-performance test sockets has never been greater. Yet, traditional socket design validation methods—such as per-pin ...
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