At electronica 2022, Renesas Electronics Corp. announced that it has expanded its low-power WAN product line as part of its strategy to deliver connectivity devices for smart cities, smart homes, ...

The cost prohibition presented by physical SIMs in today’s growing IoT ecosystem. The advent of eSIM to overcome scalability issues. How eSIM and iSIM can open up new IoT opportunities. The typical ...

5G chipmakers have placed a lot of attention on supporting new 5G technologies, including 5G-Advanced, satellite non-terrestrial network (NTN) connectivity, 5G fixed wireless access (FWA), and 5G Open ...

When it comes to multi-chip module (MCM) manufacturing, fan-out wafer-level and fan-out panel-level packaging have received a lot of coverage recently. Every week, it seems like there is an ...