Although it requires a new generation of test equipment, testing MEMS devices is challenging but not impossible. Since the early days of the IC industry, wafer-level test has been possible using ...

Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...

This is the fourth in our series, Think Outside the Chip….MEMS-Based Systems Solutions. In previous articles, I and my fellow authors have addressed the basic concept of MEMS-based system solutions, ...

NORTH BENNINGTON, VT. The burgeoning microelectromechanical systems (MEMS) field is full of good ideas, as researchers pursue innovations ranging from smart-weapon components to miniature medical ...

Electromechanical relays (EMR) and reed relays have served automated test equipment (ATE) applications well, but they’re not likely to satisfy their needs in the future, as ATE manufacturers strive to ...