As we enter the AI era, the demand for enhanced connectivity in cloud services and AI computing continues to surge. With Moore’s Law slowing down, the increasing data rate requirements are surpassing ...

In the largest single foreign investment in US history, Taiwan Semiconductor Manufacturing Company has unveiled a $100 billion investment, drawing global attention and prompting concern in Taiwan.

The semiconductor industry is a hallmark of technological innovation, evolving rapidly to meet the demands of an increasingly digital world. At its core, semiconductor manufacturing involves two main ...

TAICHUNG, Taiwan, Jan 16 (Reuters) - Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said ...

Nvidia’s CEO Jensen Huang has made waves by saying that his company’s most advanced artificial intelligence (AI) chip, Blackwell, will transition from CowoS-S to CoWoS-L advanced packaging technology.

ASE Technology Holding Co. is experiencing renewed growth, driven by surging demand for advanced semiconductor packaging and TSMC outsourcing CoWoS orders. ASX stock has returned 52.4% over the past ...

Amkor Technology's advanced packaging leadership and partnership with TSMC are key growth drivers, targeting a $37 per share price within a year. AMKR's expansion in Korea, Vietnam, and a new facility ...

TEMPE, Ariz.--(BUSINESS WIRE)-- Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, today announces ...

Nvidia Corp’s (NASDAQ:NVDA) demand for advanced packaging from Taiwan Semiconductor Manufacturing Co (NYSE:TSM) remains robust despite its evolving technology requirements, Reuters cites Nvidia chief ...

In an exclusive interview with TI’s director of power management R&D, we explore the role of advanced packaging in low-voltage power electronics. From state-of-the-art materials and process technology ...