NUREMBERG, Germany--(BUSINESS WIRE)--PCIM Europe – Power Integrations (NASDAQ: POWI), the leader in gate driver technology for medium- and high-voltage inverter applications, today announced the SCALE ...
(MENAFN- GlobeNewsWire - Nasdaq) Key market opportunities exist in the rapid growth and deployment of advanced SiC and GaN power devices within new energy vehicles, driven by increasing sales of 800V+ ...
Tolerating heat and helping to reduce it are both attributes that sintering offers as an alternative to soldering in power electronics applications. Doing more with less and, of course, packing more ...
BOSTON, Oct. 10, 2019 /PRNewswire/ -- The new IDTechEx Report "Die Attach Materials for Power Electronics in Electric Vehicles 2020-2030", investigates the market for various die and substrate attach ...
Die attach materials form the cornerstone of reliable power electronic packaging, providing the essential bond between semiconductor devices and their substrates. Recent advances have focused on ...
Infineon Technologies AG uses the advanced neutral-point-clamped (ANPC) topology for its hybrid silicon-carbide (SiC) and IGBT power module EasyPACK 2B in the 1200-V family. Optimizing for sweet-spot ...
Results that may be inaccessible to you are currently showing.
Hide inaccessible results