Hsinchu, Taiwan – Apr. 19, 2024 – Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that the GLink-3D interface (GUC’s Link for 3D die stacking) for the TSMC 3DFabric SoIC-X 3D ...
WeiHsun is a guest author and Deputy Manager, Core Methodology Department, at Global Unichip Corp. In the rapidly evolving world of ASIC design, the shift from monolithic to 2.5D and 3D multi-die ...
Built on Synopsys' Fusion Design Platform, world-class engines and data model, 3DIC Compiler offers a consolidated end-to-end solution with a full array of capabilities for advanced multi-die system ...
Taipei, Taiwan, Jan. 16, 2025 (GLOBE NEWSWIRE) -- Alchip Technologies, Limited, the high-performance ASIC leader, has formally opened its three-dimensional integrated circuit (3DIC) design services ...
The paper, entitled “A Case Study Demonstrating the Advantages of 224G Interconnects and 3DIC Architectures for Artificial Intelligence ICs,” provided a detailed explanation of Alchip’s proven design ...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that the GLink-3D interface (GUC's Link for 3D die stacking) for the TSMC 3DFabric SoIC-X 3D stacking platform passed ...
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