Manufacturing-aware system design treats dies, interposers, packages, and analysis as a single, coherent system.

The days of “throwing it over the wall” are over. Heterogeneous integration is ushering in a new era of silicon chip design with collaboration at its core—one that lives or dies on seamless ...

3D integrated circuits promise smaller, faster devices with lower power consumption. Vertically stacked 3D integrated circuits also enable novel in-memory and in-sensor computing paradigms and ...

Bernin (France), June 3, 2025 – Soitec (Euronext – Tech Leaders), a world leader in the design and production of innovative semiconductor materials, today announced a strategic collaboration with ...

Designers, who need to build high performance real-time sensing systems, are greatly challenged since every building block in the system needs to be built with a technology that allows that building ...

TOKYO--(BUSINESS WIRE)--OKI (TOKYO: 6703), in collaboration with Nisshinbo Micro Devices Inc. (Head office: Tokyo; President: Keiichi Yoshioka), has successfully achieved three-dimensional (3D) ...

HSINCHU, July 15, 2025 /PRNewswire/ -- InPsytech, a leading provider of high-speed semiconductor IP solutions and a member of the Egis Group, announced that it has successfully taped out its advanced ...

The development of computing technology in the late 18th century led to a change in computer architecture from the 1960s 2D drawing age to the present-day machine learning era, which uses algorithms, ...

YOKOHAMA, Japan, Aug. 27, 2025 /PRNewswire/ -- Socionext, the Solution SoC company, today announced the availability of 3DIC support in its portfolio of well-proven capabilities for the delivery of ...

The Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office (MTO) is requesting information to guide the establishment of a domestic research and development (R&D) center for ...

Hybrid, 3D integrated optical transceiver. (A,B) The test setup: the photonic chip (PIC) is placed on a circuit board (green), and the electronic chip (EIC) is bonded on top of the photonic chip. (C) ...