Placing logic on logic may sound like a small step, but several problems must be overcome to make it a reality. True 3D involves wafers stacked on top of each other in a highly integrated manner. This ...

Creating real 3D designs is proving to be much more complex and difficult than 2.5D, requiring significant innovation in both technology and tools. While there has been much discussion about 3D ...

Researchers from Penn State have demonstrated a novel method of 3D integration using 2D materials. This advancement, detailed in their recent study, addresses the growing challenge of fitting more ...